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SPN03N60S5 - Infineon

Description: N-Channel 600 V 700mA (Ta) 1.8W (Ta) Surface Mount PG-SOT223-4

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SPN03N60S5 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - PG-SOT223-4_2024-2
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3D Models
SPN03N60S5 - Infineon  - 3D model - SOT223 (3-Pin) - PG-SOT223-4_2024-2
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SPN03N60S5 Details

  • Manufacturer Part Number:

    SPN03N60S5

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-223

  • Package Description:

    SOT-223, 4 PIN

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    HIGH VOLTAGE

  • Avalanche Energy Rating (Eas):

    100 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    0.7 A

  • Drain-source On Resistance-Max:

    1.4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.8 W

  • Pulsed Drain Current-Max (IDM):

    3 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

SPN03N60S5 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the SPN03N60S5 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. As a general guideline, Infineon recommends following the SOA curves provided in the application note AN2013-03-01.
  • To ensure the SPN03N60S5 is fully turned on and off, the gate-source voltage (VGS) should be driven to the recommended levels: VGS = 10V for turn-on and VGS = -5V for turn-off. Additionally, the gate drive circuit should be designed to provide a fast rise and fall time (tr and tf) to minimize switching losses.
  • For optimal performance and thermal management, Infineon recommends following the PCB layout guidelines provided in the application note AN2013-03-01. This includes using a copper area of at least 1 cm² for the drain and source pins, and ensuring good thermal conductivity between the MOSFET and the heat sink or PCB.
  • The SPN03N60S5 is suitable for high-frequency switching applications up to 100 kHz. However, the device's performance and reliability may be affected by high-frequency operation. It is recommended to consult Infineon's application notes and simulation tools to ensure the device meets the specific application requirements.
  • The internal diode of the SPN03N60S5 can be handled by using a freewheeling diode (D1) in parallel with the MOSFET. This diode should be selected based on the application's requirements and should have a similar voltage rating and current capability as the MOSFET.

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