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SQ7415CENW-T1_GE3 - Vishay

Description: MOSFET P-CHANNEL 60-V (D-S) 175C MOSFET

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SQ7415CENW-T1_GE3 - Vishay PCB footprint - Other - Other - PowerPAK 1212-8S
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SQ7415CENW-T1_GE3 - Vishay  - 3D model - Other - PowerPAK 1212-8S
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SQ7415CENW-T1_GE3 Details

  • Manufacturer Part Number:

    SQ7415CENW-T1_GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    26 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    16 A

  • Drain-source On Resistance-Max:

    0.065 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    105 pF

  • JESD-30 Code:

    S-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    53 W

  • Pulsed Drain Current-Max (IDM):

    64 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Pure Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    72 ns

  • Turn-on Time-Max (ton):

    24 ns

SQ7415CENW-T1_GE3 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SQ7415CENW-T1_GE3 can be found in the Vishay Intertechnologies' application note AN42172, which provides guidelines for PCB layout and assembly.
  • The SQ7415CENW-T1_GE3 has a thermal pad that should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the thermal plane.
  • The SQ7415CENW-T1_GE3 has an operating temperature range of -40°C to 150°C, but the maximum junction temperature (TJ) should not exceed 150°C.
  • Yes, the SQ7415CENW-T1_GE3 is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • The SQ7415CENW-T1_GE3 should be soldered to the PCB using a reflow soldering process with a peak temperature of 260°C. The device should be aligned with the PCB pads and the solder paste should be applied according to the manufacturer's recommendations.

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SQ7415CENW-T1_GE3 Overview

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