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SQ9407EY-T1_GE3 - Vishay

Description: MOSFET P-CHANNEL 60V 4.6A 8SO

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SQ9407EY-T1_GE3 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - SO8
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SQ9407EY-T1_GE3 - Vishay  - 3D model - Small Outline Packages - SO8
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SQ9407EY-T1_GE3 Details

  • Manufacturer Part Number:

    SQ9407EY-T1_GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMALL OUTLINE, R-PDSO-G8

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.4

  • Avalanche Energy Rating (Eas):

    20 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    4.6 A

  • Drain-source On Resistance-Max:

    0.085 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    75 pF

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    18.5 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    66 ns

  • Turn-on Time-Max (ton):

    37 ns

SQ9407EY-T1_GE3 Frequently Asked Questions (FAQs)

  • Store the components in a dry, cool place, away from direct sunlight, and avoid exposure to moisture, dust, and extreme temperatures.
  • Use an ESD wrist strap, mat, or workstation, and ensure all equipment and tools are grounded. Handle components by the body, not the leads, and avoid touching the component pins.
  • Use a soldering profile with a peak temperature of 240°C (464°F) for 3-5 seconds, and ensure the component is not exposed to temperatures above 260°C (500°F) for more than 10 seconds.
  • Yes, but ensure the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent vibration-induced damage.
  • Use a soft, dry brush to remove any debris or dust. Avoid using chemicals, solvents, or ultrasonic cleaning methods, as they may damage the component.

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SQ9407EY-T1_GE3 Overview

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