The recommended PCB footprint for the SQJ952EP-T1_BE3 is a standard 1206 package with a pad size of 1.3 mm x 1.3 mm and a spacing of 0.5 mm between pads.
To prevent damage during soldering, it's recommended to use a soldering iron with a temperature of 260°C (500°F) or less, and to avoid applying excessive force or pressure to the component. Additionally, use a solder with a low melting point and a flux that is compatible with the component's materials.
The maximum operating temperature range for the SQJ952EP-T1_BE3 is -55°C to 150°C, with a storage temperature range of -55°C to 180°C.
Yes, the SQJ952EP-T1_BE3 is RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) compliant, meeting the requirements for lead-free and halogen-free materials.
The SQJ952EP-T1_BE3 should be stored in a dry, cool place, away from direct sunlight and moisture. It's recommended to store the components in their original packaging or in a sealed bag to prevent damage from electrostatic discharge (ESD).
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SQJ952EP-T1_BE3 Overview
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