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SRF1010DA-150M - Bourns

Description: 15 µH Shielded Drum Core, Wirewound Inductor 4.6 A 45.5mOhm Max Nonstandard , -55°C ~ 155°C

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PCB Footprints
SRF1010DA-150M - Bourns PCB footprint - Other - Other - 12.0mm x 9.6mm x 11.3mm
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3D Models
SRF1010DA-150M - Bourns  - 3D model - Other - 12.0mm x 9.6mm x 11.3mm
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SRF1010DA-150M Details

  • Manufacturer Part Number:

    SRF1010DA-150M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Case/Size Code:

    4738

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.0455 Ω

  • Inductance-Nom (L):

    15 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    2

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    11.3 mm

  • Package Length:

    12 mm

  • Package Style:

    SMT

  • Package Width:

    9.6 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    4.6 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    10 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL IN-LINE

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRF1010DA-150M Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane, and keeping the component away from high-frequency noise sources. A 4-layer PCB with a dedicated ground plane is ideal. Refer to Bourns' application notes for more details.
  • Follow the recommended soldering profile (260°C peak temperature, 3°C/s ramp rate) and use a solder with a melting point above 217°C. Avoid applying excessive force or pressure during soldering, and ensure the component is properly seated on the PCB.
  • The SRF1010DA-150M is rated for operation from -40°C to +125°C. However, derating may be necessary for high-frequency applications or extreme environmental conditions. Consult the datasheet and Bourns' application notes for more information.
  • While the SRF1010DA-150M is a high-quality component, it may not meet the specific requirements of high-reliability or aerospace applications. Bourns offers specialized components and screening options for these markets. Contact Bourns' sales team or application engineers for more information.
  • Follow proper ESD handling procedures, including the use of ESD-protective packaging, wrist straps, and mats. Ensure that all personnel handling the component are properly grounded, and avoid touching the component's pins or body.

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SRF1010DA-150M Overview

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