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SRN2508A-3R3M - Bourns

Description: Power Inductors - SMD 3.3uH 20% 0.85A AEC-Q200

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SRN2508A-3R3M - Bourns PCB footprint - Other - Other - SRN2508A-3R3M-3
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SRN2508A-3R3M Details

  • Manufacturer Part Number:

    SRN2508A-3R3M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.1

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.3 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    0.85 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    110 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT: 20%

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

SRN2508A-3R3M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SRN2508A-3R3M can be found in the Bourns Application Note S-8151, which provides detailed information on pad layout and spacing for optimal performance and reliability.
  • While the SRN2508A-3R3M is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management strategies to ensure reliable operation in high-temperature environments. Consult the datasheet and Bourns' thermal management guidelines for more information.
  • To minimize EMI and RFI emissions, follow proper PCB design and layout practices, such as using ground planes, shielding, and filtering. Additionally, consider using EMI-absorbing materials and following Bourns' guidelines for EMI reduction.
  • The maximum allowable voltage for the SRN2508A-3R3M is 50V, as specified in the datasheet. Exceeding this voltage may result in damage or failure of the component.
  • The SRN2508A-3R3M is designed to withstand moderate vibration levels. However, for high-vibration environments, it's recommended to consider additional mechanical support or mounting options to ensure the component's reliability and performance.

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SRN2508A-3R3M Overview

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