SRN3012TA-1R0Y footprint, schematic symbol and 3D model by Bourns

Symbol

PCB Footprints

3D Models

SRN3012TA-1R0Y Details

The recommended land pattern for the SRN3012TA-1R0Y can be found in the Bourns Application Note S-8151, which provides guidelines for PCB layout and land pattern design.
The SRN3012TA-1R0Y has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal pad on the PCB can help dissipate heat, and a thermal interface material can be used to improve heat transfer.
The recommended soldering profile for the SRN3012TA-1R0Y is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second. This profile ensures reliable solder joints and minimizes thermal stress on the component.
Yes, the SRN3012TA-1R0Y is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent movement or detachment during vibration.
To ensure the SRN3012TA-1R0Y meets your specific application's requirements, review the datasheet and application notes, and consult with Bourns' technical support team if necessary. Additionally, consider performing application-specific testing and validation to ensure the component meets your requirements.

System Verified

Use the download button to access the SRN3012TA-1R0Y schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like SRN30, or try a keyword search, such as Fixed Inductors

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →