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SRN6045-3R3Y - Bourns

Description: Power Inductor semi-shielded SMD 3.3uH Bourns SRN6045 Series Shielded Wire-wound SMD Inductor with a Ferrite Core, 3.3 uH /-30% 5A Idc

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PCB Footprints
SRN6045-3R3Y - Bourns PCB footprint - Inductor Moulded - Inductor Moulded - SRN6045 Series
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3D Models
SRN6045-3R3Y - Bourns  - 3D model - Inductor Moulded - SRN6045 Series
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SRN6045-3R3Y Details

  • Manufacturer Part Number:

    SRN6045-3R3Y

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.2

  • Case/Size Code:

    2424

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.0302 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e1

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    4.5 mm

  • Package Length:

    6 mm

  • Package Style:

    SMT

  • Package Width:

    6 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    3.2 A

  • Self Resonance Frequency:

    27 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    7.96 MHz

  • Tolerance:

    30%

SRN6045-3R3Y Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application notes. It's essential to follow these guidelines to ensure optimal performance, low inductance, and minimal parasitic effects.
  • To handle the high current rating, ensure your PCB design includes adequate copper thickness, width, and spacing to minimize resistive losses and thermal issues. Also, consider using thermal vias and heat sinks if necessary.
  • To minimize EMI and RFI, use proper shielding, grounding, and decoupling techniques in your design. Additionally, consider using EMI filters or common-mode chokes in conjunction with the SRN6045-3R3Y.
  • While the SRN6045-3R3Y is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management in your design to ensure reliable operation in high-temperature environments.
  • To ensure reliability and longevity, follow proper storage and handling guidelines, avoid exceeding the recommended operating conditions, and implement adequate protection circuits to prevent overvoltage, overcurrent, and ESD events.

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SRN6045-3R3Y Overview

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