SRN6045TA-3R3Y footprint, schematic symbol and 3D model by Bourns

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SRN6045TA-3R3Y Details

The recommended land pattern for SRN6045TA-3R3Y can be found in the Bourns Application Note S-8151, which provides guidelines for PCB layout and land pattern design.
To handle thermal considerations, ensure good thermal conductivity between the component and the PCB by using a thermal pad or thermal via, and consider using a heat sink or thermal interface material if necessary.
The maximum operating temperature range for SRN6045TA-3R3Y is -40°C to +125°C, but it's recommended to derate the component's power rating above 80°C to ensure reliability.
Yes, SRN6045TA-3R3Y is designed to withstand vibrations up to 10G, but it's recommended to follow proper mounting and soldering techniques to ensure the component's reliability in high-vibration environments.
To ensure reliability in high-humidity environments, follow proper storage and handling procedures, and consider using a conformal coating or potting compound to protect the component from moisture.

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Use the download button to access the SRN6045TA-3R3Y schematic symbol, PCB footprint, and 3D model.

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