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SRN8040TA-100M - Bourns

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SRN8040TA-100M - Bourns - PCB symbol
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PCB Footprints
SRN8040TA-100M - Bourns PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - SRN8040TA-101M
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SRN8040TA-100M - Bourns - 3D model - Inductors Precision Moulded - SRN8040TA-101M
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SRN8040TA-100M Details

  • Manufacturer Part Number:

    SRN8040TA-100M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.7

  • Case/Size Code:

    3131

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.033 Ω

  • Inductance-Nom (L):

    10 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    3.7 mm

  • Package Length:

    8 mm

  • Package Style:

    SMT

  • Package Width:

    8 mm

  • Packing Method:

    TR, 13 Inch

  • Quality Factor-Min (at L-nom):

    15

  • Rated Current-Max:

    4.6 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    25 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT: 20%

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

SRN8040TA-100M Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central ground plane and minimal track lengths is recommended. Ensure the input and output tracks are separated and shielded to minimize electromagnetic interference (EMI).
  • Ensure good airflow around the component, avoid overheating nearby components, and consider using a heat sink if operating in high-temperature environments. Monitor the component's temperature using a thermocouple or thermal imaging camera.
  • Follow the recommended soldering profile: peak temperature 240°C, time above 217°C 20-40 seconds, and a maximum of 3 reflows. Use a solder with a melting point below 217°C to prevent damage.
  • Yes, but ensure the component is securely mounted to the PCB using a suitable adhesive or mechanical fastening. Consider using a vibration-dampening material or potting compound to reduce stress on the component.
  • Use a multimeter to measure voltage and current at the input and output. Check for signs of overheating, physical damage, or corrosion. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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SRN8040TA-100M Overview

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