SRP0412-4R7K - Bourns

SRP0412-4R7K Frequently Asked Questions (FAQs)

• What is the recommended land pattern for SRP0412-4R7K?
  The recommended land pattern for SRP0412-4R7K is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
• Can I use SRP0412-4R7K in a high-temperature application?
  SRP0412-4R7K is rated for operation up to 125°C, but it's recommended to derate the component's power rating at higher temperatures. Consult the datasheet for derating curves and consult with a Bourns application engineer for specific guidance.
• How do I handle the component's moisture sensitivity?
  SRP0412-4R7K is a moisture-sensitive device (MSD) and requires proper handling and storage to prevent damage. Follow the recommended storage and handling procedures outlined in the datasheet and industry standards such as IPC/JEDEC J-STD-033.
• What is the recommended soldering profile for SRP0412-4R7K?
  The recommended soldering profile for SRP0412-4R7K is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Consult the datasheet for a detailed soldering profile and consult with a Bourns application engineer for specific guidance.
• Can I use SRP0412-4R7K in a high-vibration application?
  SRP0412-4R7K is designed to withstand moderate vibration levels, but it's recommended to consult with a Bourns application engineer to determine the component's suitability for specific vibration requirements.