SRP1238A-1R2M footprint, schematic symbol and 3D model by Bourns

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SRP1238A-1R2M Details

The recommended land pattern for SRP1238A-1R2M is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
Yes, SRP1238A-1R2M is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's performance and reliability may degrade at extreme temperatures.
Handle the SRP1238A-1R2M by the edges to prevent damage to the component. Use a vacuum pickup or tweezers to handle the component, and avoid touching the component's leads or body. For rework, use a low-temperature soldering iron and a solder with a low melting point.
Yes, SRP1238A-1R2M is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, the component's solderability may vary depending on the specific soldering process and conditions.
Store SRP1238A-1R2M in a dry, cool place, away from direct sunlight and moisture. Handle the component in an electrostatic discharge (ESD)-protected environment, and use anti-static packaging and materials to prevent damage.

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