SRP1238A-R33M - Bourns

SRP1238A-R33M Frequently Asked Questions (FAQs)

• What is the recommended land pattern for SRP1238A-R33M?
  The recommended land pattern for SRP1238A-R33M is a rectangular pad with a size of 2.5mm x 1.3mm, with a 0.5mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
• Can I use SRP1238A-R33M in a high-temperature environment?
  SRP1238A-R33M is rated for operation up to 125°C, but it's not recommended to use it in high-temperature environments above 105°C for extended periods. Prolonged exposure to high temperatures can affect the component's reliability and lifespan.
• How do I handle the SRP1238A-R33M during assembly to prevent damage?
  Handle SRP1238A-R33M by the edges or the body, avoiding touching the terminations or the component's surface. Use anti-static wrist straps, mats, or tables to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component.
• What is the recommended soldering profile for SRP1238A-R33M?
  The recommended soldering profile for SRP1238A-R33M is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
• Can I use SRP1238A-R33M in a humid environment?
  SRP1238A-R33M is not hermetically sealed, so it's not recommended for use in humid environments. Moisture can penetrate the component and affect its performance and reliability. If you must use it in a humid environment, consider applying a conformal coating to protect the component.