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SRP1245CC-150M - Bourns

Description: Ind,13.5x12.5x4.8mm,15uH±20%,9A,shd

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PCB Footprints
SRP1245CC-150M - Bourns PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - SRP1245A Series
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3D Models
SRP1245CC-150M - Bourns  - 3D model - Inductors Precision Moulded - SRP1245A Series
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SRP1245CC-150M Details

  • Manufacturer Part Number:

    SRP1245CC-150M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.8

  • Case/Size Code:

    5349

  • Construction:

    Shielded

  • Core Material:

    CARBONYL POWDER

  • DC Resistance:

    0.038 Ω

  • Inductance-Nom (L):

    15 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    4.8 mm

  • Package Length:

    13.5 mm

  • Package Style:

    SMT

  • Package Width:

    12.5 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    9 A

  • Self Resonance Frequency:

    8 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP1245CC-150M Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
  • The SRP1245CC-150M has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K is recommended.
  • Bourns recommends a soldering profile with a peak temperature of 260°C for a maximum of 10 seconds. The soldering process should be done in a nitrogen atmosphere to minimize oxidation.
  • Yes, the SRP1245CC-150M is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method.
  • To troubleshoot issues with the SRP1245CC-150M, start by verifying the PCB layout and ensuring that the component is properly soldered. Check for signs of overheating, such as discoloration or deformation. Use a multimeter to measure the resistance and inductance of the component. If the issue persists, contact Bourns' technical support for further assistance.

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SRP1245CC-150M Overview

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