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SRP1250-3R3M - Bourns

Description: Bourns SRP1250 Series Shielded Wire-wound SMD Inductor with a Iron Core, 3.3 μH ±20% 32A Idc

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SRP1250-3R3M - Bourns PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - SRP1250-3R3M
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SRP1250-3R3M - Bourns  - 3D model - Inductors Precision Moulded - SRP1250-3R3M
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SRP1250-3R3M Details

  • Manufacturer Part Number:

    SRP1250-3R3M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    1

  • Case/Size Code:

    5050

  • Construction:

    Rectangular

  • Core Material:

    IRON

  • DC Resistance:

    0.0092 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    5.2 mm

  • Package Length:

    12.7 mm

  • Package Style:

    SMT

  • Package Width:

    12.7 mm

  • Packing Method:

    TR, Embossed , 13 Inch

  • Rated Current-Max:

    15 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP1250-3R3M Frequently Asked Questions (FAQs)

  • A good PCB layout for the SRP1250-3R3M would involve keeping the input and output traces separate, using a solid ground plane, and minimizing the length of the input and output leads. Additionally, it's recommended to use a low-ESR capacitor on the output to filter out high-frequency noise.
  • To ensure the SRP1250-3R3M operates within its specified temperature range, make sure to provide adequate heat sinking, avoid overheating, and keep the device away from high-temperature sources. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • The maximum allowable ripple current for the SRP1250-3R3M is not explicitly stated in the datasheet, but as a general rule of thumb, it's recommended to keep the ripple current below 30% of the rated current to ensure reliable operation.
  • While the SRP1250-3R3M is a robust device, it's still important to consider the vibration environment when using it in a high-vibration application. Bourns recommends following the IPC-9592 standard for vibration testing and ensuring the device is properly secured to the PCB to minimize the risk of mechanical failure.
  • To troubleshoot issues with the SRP1250-3R3M, start by checking the input voltage, output voltage, and current draw. Verify that the device is properly soldered and that there are no signs of physical damage. Use an oscilloscope to check for noise or oscillations on the output, and consult the datasheet and application notes for guidance on troubleshooting common issues.

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SRP1250-3R3M Overview

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