SRP1265A-470M footprint, schematic symbol and 3D model by Bourns

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SRP1265A-470M Details

The recommended PCB footprint for the SRP1265A-470M is a rectangular pad with dimensions of 12.7 mm x 6.35 mm, with a 1.27 mm diameter hole in the center for the radial lead.
Yes, the SRP1265A-470M is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's performance and lifespan may be affected at extreme temperatures.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder to the component leads. Avoid applying excessive heat or solder, as this can damage the component.
Yes, the SRP1265A-470M is compatible with lead-free soldering processes, and is RoHS compliant.
Store the SRP1265A-470M in a dry, cool place, away from direct sunlight and moisture. Handle the component by the body, avoiding touching the leads or electrical contacts to prevent damage or contamination.

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