SRP1265C-330M footprint, schematic symbol and 3D model by Bourns

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SRP1265C-330M Details

The recommended PCB footprint for the SRP1265C-330M is a rectangular pad with dimensions of 12.7 mm x 6.35 mm, with a 1.27 mm diameter hole in the center for the radial lead.
Yes, the SRP1265C-330M is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's performance and lifespan may be affected at extreme temperatures.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pads. Hold the component in place with tweezers and apply gentle pressure while soldering.
The maximum allowable voltage for the SRP1265C-330M is 350 VDC. Exceeding this voltage may damage the component or affect its performance.
Yes, the SRP1265C-330M is suitable for high-frequency applications up to 100 kHz. However, the component's performance may degrade at higher frequencies, and additional filtering or shielding may be required.

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