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SRP1265CC-4R7M - Bourns

Description: Ind,13.5x12.5x6.2mm,4.7uH±20%,20A,shd

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PCB Footprints
SRP1265CC-4R7M - Bourns PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - SRP1265CC-1
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3D Models
SRP1265CC-4R7M - Bourns  - 3D model - Inductors Precision Moulded - SRP1265CC-1
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SRP1265CC-4R7M Details

  • Manufacturer Part Number:

    SRP1265CC-4R7M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Case/Size Code:

    4949

  • Construction:

    Rectangular

  • Core Material:

    CARBONYL POWDER

  • DC Resistance:

    0.0095 Ω

  • Inductance-Nom (L):

    4.7 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    6.2 mm

  • Package Length:

    12.5 mm

  • Package Style:

    SMT

  • Package Width:

    12.5 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    20 A

  • Self Resonance Frequency:

    17 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP1265CC-4R7M Frequently Asked Questions (FAQs)

  • The recommended land pattern for SRP1265CC-4R7M can be found in the Bourns Application Note S-308, which provides detailed information on land pattern design and layout considerations.
  • While the SRP1265CC-4R7M is specified up to 125°C, it's essential to consider the derating curves provided in the datasheet. For high-temperature applications, it's best to consult with Bourns' technical support team to ensure the component meets the specific application requirements.
  • Bourns recommends following the ESD handling procedures outlined in the ANSI/ESD S20.20 standard. Additionally, it's essential to implement proper PCB design and layout practices to minimize ESD risks, such as using ESD protection devices and following proper grounding techniques.
  • Bourns recommends following the soldering profile guidelines outlined in the IPC/J-STD-020D standard. The recommended soldering temperature, time, and other parameters can be found in the datasheet or by consulting with Bourns' technical support team.
  • While the SRP1265CC-4R7M is designed to meet the requirements of various industries, including automotive and industrial, it's essential to consider the specific vibration requirements of your application. Consult with Bourns' technical support team to ensure the component meets the specific application requirements.

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SRP1265CC-4R7M Overview

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