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SRP1270-8R2M - Bourns

Description: Bourns, SRP1270, 1270 Shielded Wire-wound SMD Inductor with a Iron Core, 8.2 μH ±20% Wire-Wound 17A Idc

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PCB Footprints
SRP1270-8R2M - Bourns PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - SRP1270-1
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3D Models
SRP1270-8R2M - Bourns  - 3D model - Inductors Precision Moulded - SRP1270-1
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SRP1270-8R2M Details

  • Manufacturer Part Number:

    SRP1270-8R2M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    1

  • Case/Size Code:

    5151

  • Construction:

    Shielded

  • Core Material:

    IRON

  • DC Resistance:

    0.0155 Ω

  • Inductance-Nom (L):

    8.2 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    2

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    7 mm

  • Package Length:

    12.9 mm

  • Package Style:

    SMT

  • Package Width:

    12.9 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    11 A

  • Self Resonance Frequency:

    11 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP1270-8R2M Frequently Asked Questions (FAQs)

  • A good PCB layout for the SRP1270-8R2M would involve keeping the input and output traces as short as possible, using a solid ground plane, and placing the component near the power source to minimize noise and EMI.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component.
  • The SRP1270-8R2M has an operating temperature range of -40°C to +125°C, but it's recommended to operate it within -20°C to +85°C for optimal performance and reliability.
  • Yes, the SRP1270-8R2M is designed to withstand vibrations up to 10G, but it's recommended to follow proper mounting and soldering techniques to ensure the component remains securely attached to the PCB.
  • To prevent ESD damage, handle the SRP1270-8R2M with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the component's pins or leads, and use ESD-safe packaging and storage.

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SRP1270-8R2M Overview

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