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SRP1513CA-4R7M - Bourns

Description: Shielded Power Inductor, 4.7uH

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PCB Footprints
SRP1513CA-4R7M - Bourns PCB footprint - Other - Other - SRP1513CA HEIGHT 13
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3D Models
SRP1513CA-4R7M - Bourns  - 3D model - Other - SRP1513CA HEIGHT 13
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SRP1513CA-4R7M Details

  • Manufacturer Part Number:

    SRP1513CA-4R7M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.3

  • Case/Size Code:

    6561

  • Construction:

    Rectangular

  • Core Material:

    METAL ALLOY POWDER

  • DC Resistance:

    0.0033 Ω

  • Inductance-Nom (L):

    4.7 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    12.7 mm

  • Package Length:

    16.5 mm

  • Package Style:

    SMT

  • Package Width:

    15.5 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    31 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    13 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP1513CA-4R7M Frequently Asked Questions (FAQs)

  • The recommended land pattern for SRP1513CA-4R7M can be found in the Bourns Application Note S-8151, which provides detailed guidelines for PCB layout and land pattern design.
  • While the SRP1513CA-4R7M is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management strategies to ensure reliable operation in high-temperature applications. Consult with Bourns' technical support for specific guidance.
  • To prevent ESD damage, follow proper handling and storage procedures, such as using ESD-safe packaging, wrist straps, and mats. Additionally, ensure that your PCB design includes ESD protection components and follows ESD-safe layout practices.
  • Bourns recommends following the JEDEC J-STD-020D.1 standard for soldering profiles. A typical profile would include a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C.
  • While the SRP1513CA-4R7M is not hermetically sealed, it is designed to meet the requirements of IPC/JEDEC J-STD-020D.1 for moisture sensitivity. However, it's crucial to follow proper conformal coating and sealing practices to ensure reliability in humid or wet environments.

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SRP1513CA-4R7M Overview

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