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SRP1513CA-8R2M - Bourns

Description: Shielded Power Inductor, 8.2uH

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PCB Footprints
SRP1513CA-8R2M - Bourns PCB footprint - Other - Other - SRP1513CA HEIGHT 13
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3D Models
SRP1513CA-8R2M - Bourns  - 3D model - Other - SRP1513CA HEIGHT 13
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SRP1513CA-8R2M Details

  • Manufacturer Part Number:

    SRP1513CA-8R2M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.3

  • Case/Size Code:

    6561

  • Construction:

    Rectangular

  • Core Material:

    METAL ALLOY POWDER

  • DC Resistance:

    0.00574 Ω

  • Inductance-Nom (L):

    8.2 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    12.7 mm

  • Package Length:

    16.5 mm

  • Package Style:

    SMT

  • Package Width:

    15.5 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    26 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    9 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP1513CA-8R2M Frequently Asked Questions (FAQs)

  • The recommended land pattern for SRP1513CA-8R2M can be found in the Bourns Application Note S-8151, which provides a detailed guide for PCB layout and land pattern design.
  • While the SRP1513CA-8R2M is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management to ensure reliable operation in high-temperature environments. Consult with Bourns' application engineers for specific guidance.
  • To minimize EMI and RFI emissions, follow proper PCB layout and design practices, such as using a solid ground plane, minimizing loop areas, and using shielding or filtering components as needed. Consult with Bourns' application engineers for specific guidance.
  • The recommended soldering profile for SRP1513CA-8R2M is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second. Consult with Bourns' application engineers for specific guidance.
  • While the SRP1513CA-8R2M is designed to operate in a variety of environments, it's essential to consider the moisture sensitivity level (MSL) rating and follow proper handling and storage procedures to prevent damage. Consult with Bourns' application engineers for specific guidance.

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SRP1513CA-8R2M Overview

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