Bourns recommends a symmetrical PCB layout with a solid ground plane, and keeping the input and output traces as short as possible to minimize inductance and noise. A 4-layer PCB with a dedicated power plane and a solid ground plane is also recommended.
To ensure reliability in high-temperature applications, it's essential to follow proper derating guidelines, provide adequate heat sinking, and ensure good airflow around the component. Additionally, consider using a thermally conductive interface material between the component and the heat sink.
While the datasheet doesn't specify a maximum surge current, Bourns recommends following the industry-standard surge current rating of 100A for 1ms. However, it's essential to consult with Bourns' application engineers for specific guidance on surge current handling.
Yes, the SRP1770CC-150M can be used in a parallel configuration to increase the current rating. However, it's crucial to ensure that the components are properly matched, and the PCB layout is designed to minimize current imbalance and thermal mismatch between the parallel devices.
To prevent damage, store the SRP1770CC-150M in its original packaging or in a dry, cool place away from direct sunlight. Avoid exposing the component to moisture, extreme temperatures, or mechanical stress. Handle the component by the body, avoiding touching the leads or electrical contacts.
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SRP1770CC-150M Overview
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