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SRP1770TA-6R8M - Bourns

Description: 6.8 µH Shielded Drum Core, Wirewound Inductor 19 A 9.2mOhm Max Nonstandard

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PCB Footprints
SRP1770TA-6R8M - Bourns PCB footprint - Other - Other - 16.9mm x 16.9mm x 6.7mm
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3D Models
SRP1770TA-6R8M - Bourns  - 3D model - Other - 16.9mm x 16.9mm x 6.7mm
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SRP1770TA-6R8M Details

  • Manufacturer Part Number:

    SRP1770TA-6R8M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.6

  • Case/Size Code:

    6767

  • Construction:

    Rectangular

  • Core Material:

    CARBONYL POWDER

  • DC Resistance:

    0.0092 Ω

  • Inductance-Nom (L):

    6.8 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    6.7 mm

  • Package Length:

    16.9 mm

  • Package Style:

    SMT

  • Package Width:

    16.9 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    19 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    11 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP1770TA-6R8M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SRP1770TA-6R8M can be found in the Bourns application note AN-13, which provides guidelines for PCB layout and land pattern design.
  • The SRP1770TA-6R8M has a maximum operating temperature of 125°C. Ensure that the component is mounted on a PCB with adequate thermal dissipation, and consider using thermal vias or thermal pads to improve heat transfer.
  • The recommended soldering profile for the SRP1770TA-6R8M is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second.
  • Yes, the SRP1770TA-6R8M is designed to withstand high-vibration environments. However, it's recommended to follow the guidelines in the Bourns application note AN-14 for designing and testing vibration-resistant circuits.
  • The SRP1770TA-6R8M meets various safety certifications, including UL, ENEC, and CE. Ensure that your design meets the required safety standards by following the guidelines in the Bourns safety application note AN-15.

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SRP1770TA-6R8M Overview

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