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SRP2313AA-470M - Bourns

Description: BOURNS - SRP2313AA-470M - INDUCTOR, AEC-Q200, SHLD, 47UH, 14A

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Symbol
SRP2313AA-470M - Bourns - PCB symbol
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PCB Footprints
SRP2313AA-470M - Bourns PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - SRP2313AA-1
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3D Models
SRP2313AA-470M - Bourns - 3D model - Inductors Precision Moulded - SRP2313AA-1
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SRP2313AA-470M Details

  • Manufacturer Part Number:

    SRP2313AA-470M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6

  • Case/Size Code:

    9387

  • Construction:

    Rectangular

  • Core Material:

    METAL ALLOY POWDER

  • DC Resistance:

    0.0208 Ω

  • Inductance-Nom (L):

    47 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    12.6 mm

  • Package Length:

    23.5 mm

  • Package Style:

    SMT

  • Package Width:

    22 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    14 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    3.5 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP2313AA-470M Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane and a minimum of vias to minimize inductance and ensure optimal performance. A recommended layout is available in the Bourns application note 'SRP2313AA-470M Layout Guidelines'.
  • The SRP2313AA-470M is rated for operation up to 125°C, but derating is required above 85°C. Consult the datasheet for derating curves and ensure that the component is properly cooled to prevent overheating.
  • Follow the recommended soldering profile and ensure that the component is properly aligned on the PCB. Use a soldering iron with a temperature of 250°C to 260°C and a solder with a melting point of 180°C to 220°C. Avoid applying excessive force or pressure during soldering.
  • Store the SRP2313AA-470M in its original packaging or in a dry, ESD-protected environment. Avoid exposing the component to moisture, direct sunlight, or extreme temperatures. Handle the component by the edges to prevent damage to the terminations.
  • The SRP2313AA-470M is designed to withstand moderate vibration, but extreme vibration may cause the component to fail. Consult the datasheet for vibration testing results and ensure that the component is properly secured to the PCB to prevent movement.

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SRP2313AA-470M Overview

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