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SRP2510A-R68M - Bourns

Description: Bourns SRP2510A Series Shielded Wire-wound SMD Inductor 680 nH ±20% 3.4A Idc Q:35

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PCB Footprints
SRP2510A-R68M - Bourns PCB footprint - Other - Other - SRP2510A-R68M-2
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SRP2510A-R68M - Bourns  - 3D model - Other - SRP2510A-R68M-2
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SRP2510A-R68M Details

  • Manufacturer Part Number:

    SRP2510A-R68M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.8

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.044 Ω

  • Inductance-Nom (L):

    0.68 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    3.4 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    120 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

SRP2510A-R68M Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
  • The SRP2510A-R68M has a maximum operating temperature of 125°C. Ensure good airflow around the inductor, and consider using a heat sink or thermal interface material if the ambient temperature exceeds 85°C. Follow the recommended derating curve for temperature.
  • Bourns recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The component should be soldered using a solder with a melting point of 220°C (428°F) or higher.
  • The SRP2510A-R68M is designed to withstand moderate vibration levels. However, for high-vibration environments, consider using a more robust inductor or adding additional mechanical support to ensure the inductor remains securely attached to the PCB.
  • Use a suitable adhesive, such as a thermally conductive epoxy, to secure the inductor to the PCB. Ensure the inductor is properly aligned and the adhesive is applied according to the manufacturer's instructions.

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