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SRP3020TA-6R8M - Bourns

Description: BOURNS - SRP3020TA-6R8M - INDUCTOR, SHLD, 6.8UH, 1.9A, AEC-Q200

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SRP3020TA-6R8M - Bourns PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - SRP3020TA-6R8M
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SRP3020TA-6R8M - Bourns  - 3D model - Inductors Precision Moulded - SRP3020TA-6R8M
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SRP3020TA-6R8M Details

  • Manufacturer Part Number:

    SRP3020TA-6R8M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Case/Size Code:

    1413

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.3 Ω

  • Inductance-Nom (L):

    6.8 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.8 mm

  • Package Length:

    3.5 mm

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, Embossed , 13 Inch

  • Quality Factor-Min (at L-nom):

    10

  • Rated Current-Max:

    1.9 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    24 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP3020TA-6R8M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SRP3020TA-6R8M can be found in the Bourns Application Note S-8153, which provides guidelines for PCB layout and land pattern design.
  • While the SRP3020TA-6R8M is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management strategies to ensure reliable operation in high-temperature environments.
  • To prevent ESD damage, follow proper ESD handling and assembly procedures, such as using ESD-safe workstations, wrist straps, and packaging materials. Also, ensure that the device is stored in its original packaging or an ESD-safe container when not in use.
  • Bourns recommends following the JEDEC J-STD-020D.1 standard for soldering profiles, which provides guidelines for temperature, time, and other parameters to ensure reliable solder joints.
  • While the SRP3020TA-6R8M is not hermetically sealed, it is designed to operate in a variety of environments. However, it's essential to consider the moisture sensitivity level (MSL) and follow proper handling and storage procedures to prevent moisture-related issues.

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SRP3020TA-6R8M Overview

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