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SRP3212A-3R3M - Bourns

Description: Ind,3.2x2.5x1mm,3.3uH±20%,3.1A,shd

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PCB Footprints
SRP3212A-3R3M - Bourns PCB footprint - Inductors Chip - Inductors Chip - 3.2x2.5x1mm-1
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3D Models
SRP3212A-3R3M - Bourns  - 3D model - Inductors Chip - 3.2x2.5x1mm-1
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SRP3212A-3R3M Details

  • Manufacturer Part Number:

    SRP3212A-3R3M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.3

  • Case/Size Code:

    1210

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.101 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    3.1 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    28 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Nickel/Silver (Sn/Ni/Ag)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP3212A-3R3M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SRP3212A-3R3M can be found in the Bourns Application Note S-8151, which provides guidelines for surface mount assembly and layout considerations.
  • While the SRP3212A-3R3M is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management strategies to ensure reliable operation in high-temperature environments. Consult with a Bourns representative or a thermal expert for guidance.
  • Follow the EIA-583 standard for handling and storage of surface-mount devices. Store the components in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Avoid bending, flexing, or applying excessive pressure to the components.
  • The SRP3212A-3R3M is designed to meet the requirements of various industry standards for vibration and shock. However, it's crucial to evaluate the specific application requirements and consider additional mechanical support or fixation methods to ensure the component's reliability.
  • Follow the J-STD-020D.1 standard for soldering surface-mount devices. A typical soldering profile for the SRP3212A-3R3M would be a peak temperature of 260°C, with a dwell time of 10-30 seconds, and a ramp rate of 3-4°C/second.

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SRP3212A-3R3M Overview

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