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SRP5030CA-R60M - Bourns

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SRP5030CA-R60M Details

  • Manufacturer Part Number:

    SRP5030CA-R60M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    8

  • Case/Size Code:

    2221

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.00452 Ω

  • Inductance-Nom (L):

    0.6 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    2.9 mm

  • Package Length:

    5.5 mm

  • Package Style:

    SMT

  • Package Width:

    5.3 mm

  • Packing Method:

    TR, Embossed , 13 Inch

  • Rated Current-Max:

    17.7 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    68 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP5030CA-R60M Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with the chip resistors placed close to the IC pins, and using a solid ground plane to reduce noise and EMI. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is also recommended.
  • To ensure reliability in high-temperature applications, it is recommended to derate the power rating of the SRP5030CA-R60M according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal management by providing adequate heat sinking and airflow around the device.
  • Bourns recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, the SRP5030CA-R60M is designed to withstand high-vibration environments. However, it is recommended to follow proper mounting and soldering techniques to ensure the device is securely attached to the PCB. Additionally, consider using a vibration-dampening material or a conformal coating to further reduce the risk of mechanical stress.
  • To troubleshoot issues with the SRP5030CA-R60M, start by checking the power supply voltage and ensuring it is within the recommended operating range. Next, verify that the input and output signals are within the specified voltage and current limits. Use an oscilloscope to check for any signs of oscillation or noise. If the issue persists, consult the datasheet and application notes for further guidance or contact Bourns technical support.

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SRP5030CA-R60M Overview

Use the download button to access the SRP5030CA-R60M 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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