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SRP6030VA-2R2M - Bourns

Description: Power Inductors - SMD Ind,7.1x6.6x2.8mm,2.2uH+/-20%,11A,Shd,SMD

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PCB Footprints
SRP6030VA-2R2M - Bourns PCB footprint - Other - Other - 7.1x6.6x2.8mm
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3D Models
SRP6030VA-2R2M - Bourns  - 3D model - Other - 7.1x6.6x2.8mm
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SRP6030VA-2R2M Details

  • Manufacturer Part Number:

    SRP6030VA-2R2M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.1

  • Case/Size Code:

    2626

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.0258 Ω

  • Inductance-Nom (L):

    2.2 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    180 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    2.8 mm

  • Package Length:

    6.6 mm

  • Package Style:

    SMT

  • Package Width:

    6.6 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Quality Factor-Min (at L-nom):

    10

  • Rated Current-Max:

    11 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    29 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP6030VA-2R2M Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
  • The SRP6030VA-2R2M has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal pad or heat sink can be used to dissipate heat, and the component should be placed in a well-ventilated area.
  • Bourns recommends a soldering profile with a peak temperature of 260°C for 10-15 seconds. The component should be soldered using a solder with a melting point of 217°C or higher.
  • Yes, the SRP6030VA-2R2M is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage or dislodging.
  • To troubleshoot issues with the SRP6030VA-2R2M, start by verifying the component's soldering and PCB layout. Check for signs of overheating, electrical overstress, or physical damage. Use a multimeter to measure the component's resistance and inductance, and compare the results to the datasheet specifications.

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SRP6030VA-2R2M Overview

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