SRP6030VA-3R3M footprint, schematic symbol and 3D model by Bourns

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SRP6030VA-3R3M Details

Bourns recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
The SRP6030VA-3R3M has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal pad or heat sink can be used to dissipate heat, and the device should be mounted in a way that allows for good airflow.
Bourns recommends a soldering profile with a peak temperature of 260°C for a maximum of 10 seconds. The device should be soldered using a solder with a melting point of 217°C or higher.
Yes, the SRP6030VA-3R3M is designed to withstand high-vibration environments. However, it's essential to ensure that the device is properly mounted and secured to the PCB to prevent mechanical stress and damage.
The SRP6030VA-3R3M has an ESD rating of 2 kV human body model (HBM) and 1 kV charged device model (CDM). It's essential to handle the device with ESD precautions to prevent damage.

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