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SRP6060FA-6R8M - Bourns

Description: BOURNS - SRP6060FA-6R8M - INDUCTOR, SHLD, 6.8UH, 9A, AEC-Q200

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Symbol
SRP6060FA-6R8M - Bourns - PCB symbol
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PCB Footprints
SRP6060FA-6R8M - Bourns PCB footprint - Other - Other - SRP6060FA-220M
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SRP6060FA-6R8M - Bourns - 3D model - Other - SRP6060FA-220M
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SRP6060FA-6R8M Details

  • Manufacturer Part Number:

    SRP6060FA-6R8M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Case/Size Code:

    2625

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.0208 Ω

  • Inductance-Nom (L):

    6.8 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    5.8 mm

  • Package Length:

    6.6 mm

  • Package Style:

    SMT

  • Package Width:

    6.4 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    9 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    16 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP6060FA-6R8M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SRP6060FA-6R8M can be found in the Bourns application note AN-13, which provides guidelines for PCB layout and land pattern design.
  • The SRP6060FA-6R8M has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal pad on the bottom of the device can be connected to a copper plane on the PCB to dissipate heat.
  • The recommended soldering profile for the SRP6060FA-6R8M is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second. This profile ensures reliable solder joints and minimizes thermal stress on the device.
  • Yes, the SRP6060FA-6R8M is designed to withstand high-vibration environments. However, it's essential to ensure that the device is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage or detachment during vibration.
  • The SRP6060FA-6R8M meets various safety certifications, including UL94V-0 and IEC 62133. To ensure compliance, follow the recommended PCB layout and component placement guidelines, and ensure that the device is used within its specified operating conditions.

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SRP6060FA-6R8M Overview

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