SRP7028AA-1R0M footprint, schematic symbol and 3D model by Bourns

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SRP7028AA-1R0M Details

The recommended land pattern for SRP7028AA-1R0M can be found in the Bourns Application Note S-8151, which provides detailed guidelines for PCB layout and land pattern design.
While the SRP7028AA-1R0M is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management strategies to ensure reliable performance in high-temperature applications.
To prevent ESD damage, follow proper handling and storage procedures, such as using ESD-safe materials, grounding straps, and ionizers. Additionally, consider implementing ESD protection circuits in your design.
Bourns recommends following the JEDEC J-STD-020D.1 standard for soldering profiles, which provides guidelines for temperature, time, and other parameters to ensure reliable solder joints.
While the SRP7028AA-1R0M is designed to be robust, it's crucial to consider the specific environmental requirements of your application. Bourns offers customized solutions and testing services to ensure the component meets your specific needs.

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Use the download button to access the SRP7028AA-1R0M schematic symbol, PCB footprint, and 3D model.

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