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SRP7030-1R8M - Bourns

Description: 1.8 µH Shielded Inductor 8.5 A 17mOhm Max Nonstandard

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PCB Footprints
SRP7030-1R8M - Bourns PCB footprint - Other - Other - 6.86mm x 6.47mm x 3.2mm
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3D Models
SRP7030-1R8M - Bourns  - 3D model - Other - 6.86mm x 6.47mm x 3.2mm
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SRP7030-1R8M Details

  • Manufacturer Part Number:

    SRP7030-1R8M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    CHIP

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    1

  • Case/Size Code:

    2725

  • Construction:

    Rectangular

  • Core Material:

    IRON

  • DC Resistance:

    0.017 Ω

  • Inductance-Nom (L):

    1.8 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    3.2 mm

  • Package Length:

    6.86 mm

  • Package Style:

    SMT

  • Package Width:

    6.47 mm

  • Packing Method:

    TR, Embossed , 13 Inch

  • Rated Current-Max:

    8.5 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP7030-1R8M Frequently Asked Questions (FAQs)

  • The recommended land pattern for SRP7030-1R8M can be found in the Bourns Application Note S-8151, which provides guidelines for surface mount assembly and layout considerations.
  • While the SRP7030-1R8M is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management strategies to ensure reliable operation in high-temperature environments. Consult with Bourns' application engineers for specific guidance.
  • To prevent ESD damage, follow proper handling and storage procedures, such as using ESD-safe materials, grounding straps, and ionizers. Additionally, consider implementing ESD protection circuits in your design.
  • Bourns recommends following the IPC/JEDEC J-STD-020D.1 standard for soldering surface mount devices. A typical reflow profile includes a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C.
  • While the SRP7030-1R8M is designed to operate in a variety of environments, it's essential to consider the moisture sensitivity level (MSL) rating of 3, which means it can withstand up to 168 hours of exposure to 30°C/60% RH. For more extreme environments, consult with Bourns' application engineers for guidance on moisture protection strategies.

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SRP7030-1R8M Overview

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