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SRP7050AA-150M - Bourns

Description: Shielded Power Inductor 15uH

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SRP7050AA-150M - Bourns - PCB symbol
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PCB Footprints
SRP7050AA-150M - Bourns PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - 7.3mmX6.6mm
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3D Models
SRP7050AA-150M - Bourns - 3D model - Inductors Precision Moulded - 7.3mmX6.6mm
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SRP7050AA-150M Details

  • Manufacturer Part Number:

    SRP7050AA-150M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Case/Size Code:

    2926

  • Construction:

    Rectangular

  • Core Material:

    METAL ALLOY POWDER

  • DC Resistance:

    0.085 Ω

  • Inductance-Nom (L):

    15 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    4.8 mm

  • Package Length:

    7.3 mm

  • Package Style:

    SMT

  • Package Width:

    6.6 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    5 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    10 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP7050AA-150M Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
  • The SRP7050AA-150M has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K is recommended.
  • Bourns recommends a soldering profile with a peak temperature of 260°C for 10-15 seconds. The soldering process should be done in a nitrogen atmosphere to minimize oxidation.
  • Yes, the SRP7050AA-150M is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method.
  • To troubleshoot issues with the SRP7050AA-150M, start by verifying the PCB layout and ensuring that the component is properly soldered. Check for any signs of overheating, and verify that the input voltage and current are within the recommended specifications.

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SRP7050AA-150M Overview

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