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SRP7050TA-560M - Bourns

Description: 56 µH Shielded Drum Core, Wirewound Inductor 1.6 A 396mOhm Max Nonstandard -55 °C to +150 °C

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PCB Footprints
SRP7050TA-560M - Bourns PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - 6.6x7.3mm
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SRP7050TA-560M - Bourns  - 3D model - Inductors Precision Moulded - 6.6x7.3mm
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SRP7050TA-560M Details

  • Manufacturer Part Number:

    SRP7050TA-560M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Case/Size Code:

    2926

  • Construction:

    Rectangular

  • Core Material:

    CARBONYL POWDER

  • DC Resistance:

    0.396 Ω

  • Inductance-Nom (L):

    56 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    4.8 mm

  • Package Length:

    7.3 mm

  • Package Style:

    SMT

  • Package Width:

    6.6 mm

  • Packing Method:

    TR, 13 Inch

  • Quality Factor-Min (at L-nom):

    15

  • Rated Current-Max:

    1.6 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    7 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP7050TA-560M Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central ground plane and minimal track lengths is recommended. The datasheet provides a suggested PCB layout, but it's essential to consult with a PCB design expert to ensure optimal performance.
  • Use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Ensure the component is properly aligned and secured before soldering. A reflow oven can also be used for large-scale production.
  • The SRP7050TA-560M is rated for operation from -40°C to 125°C. However, it's essential to consider the specific application and environmental conditions to ensure reliable operation within the specified temperature range.
  • Yes, the SRP7050TA-560M is designed to withstand vibrations up to 10G. However, it's crucial to ensure the component is properly secured to the PCB and the PCB is mounted securely to the system to prevent damage or dislodging.
  • Handle the component in an ESD-protected environment, wear an ESD wrist strap or use ESD-protective packaging to prevent damage. Avoid touching the component's pins or leads to prevent ESD damage.

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SRP7050TA-560M Overview

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