SRP7050TA-8R2M footprint, schematic symbol and 3D model by Bourns

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SRP7050TA-8R2M Details

The recommended land pattern for the SRP7050TA-8R2M can be found in the Bourns Application Note S-8151, which provides a detailed guide for PCB layout and land pattern design.
The SRP7050TA-8R2M has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal pad on the bottom of the device can be connected to a copper plane on the PCB to dissipate heat.
The recommended soldering profile for the SRP7050TA-8R2M is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s. It's essential to follow the IPC J-STD-020 standard for soldering.
Yes, the SRP7050TA-8R2M is designed to withstand high-vibration environments. However, it's essential to ensure that the device is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage or detachment.
The SRP7050TA-8R2M meets various safety certifications, including UL94V-0 and IEC 62133. To ensure compliance, it's essential to follow the recommended PCB layout, component selection, and assembly guidelines provided by Bourns Inc.

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