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SRP7050WA-4R7M - Bourns

Description: Ind,7.9x7.3x5.2mm,4.7uH±20%,10.5A,shd

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SRP7050WA-4R7M - Bourns PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - SRP7050WA-2R2Mss
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SRP7050WA-4R7M - Bourns  - 3D model - Inductors Precision Moulded - SRP7050WA-2R2Mss
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SRP7050WA-4R7M Details

  • Manufacturer Part Number:

    SRP7050WA-4R7M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.7

  • Case/Size Code:

    2929

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.0205 Ω

  • Inductance-Nom (L):

    4.7 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    165 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    5.2 mm

  • Package Length:

    7.3 mm

  • Package Style:

    SMT

  • Package Width:

    7.3 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    10.5 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    18 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP7050WA-4R7M Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
  • The SRP7050WA-4R7M has a maximum operating temperature of 125°C. Ensure good airflow around the component, and consider using a heat sink or thermal pad if the component will be operating near its maximum temperature rating.
  • Bourns recommends a soldering profile with a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second. Ensure that the component is not exposed to temperatures above 260°C for more than 10 seconds.
  • Bourns recommends using a secure mounting method, such as screwing or adhesive, to ensure the component is firmly attached to the PCB. Additionally, consider using a vibration-dampening material, such as a silicone adhesive, to reduce the impact of vibrations on the component.
  • The SRP7050WA-4R7M has an MSL rating of 3, which means it can withstand exposure to moisture for up to 168 hours at 30°C and 60% relative humidity. Ensure proper handling and storage procedures to prevent moisture damage.

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SRP7050WA-4R7M Overview

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