SRR1206-471KL footprint, schematic symbol and 3D model by Bourns

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SRR1206-471KL Details

The recommended land pattern for the SRR1206-471KL is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
During reflow soldering, the SRR1206-471KL should be placed on a flat, even surface to prevent warping or deformation. The recommended reflow profile is 260°C peak temperature, with a ramp-up rate of 3°C/s and a dwell time of 30-60 seconds.
Yes, the SRR1206-471KL is compatible with lead-free soldering. It is designed to withstand the higher temperatures required for lead-free soldering processes.
The maximum operating temperature range for the SRR1206-471KL is -40°C to +125°C. However, the device's performance may degrade at temperatures above 85°C.
To prevent moisture absorption, the SRR1206-471KL should be stored in a dry, cool place, away from direct sunlight. The devices should be stored in their original packaging or in a sealed bag with a desiccant packet.

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