SRR1206-560YL footprint, schematic symbol and 3D model by Bourns

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SRR1206-560YL Details

The recommended land pattern for SRR1206-560YL is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While SRR1206-560YL is rated for operation up to 125°C, it's not recommended for use in high-temperature applications above 105°C without proper derating. Consult the datasheet and Bourns' application notes for more information on temperature derating.
Handle the SRR1206-560YL with care during PCB assembly to prevent mechanical stress, bending, or twisting. Use a vacuum pick-up tool or tweezers to handle the component, and avoid touching the component's leads or body to prevent electrostatic discharge (ESD) damage.
The recommended soldering profile for SRR1206-560YL is a peak temperature of 240°C ± 5°C, with a dwell time of 30-60 seconds above 217°C. Consult the datasheet and Bourns' application notes for more information on soldering profiles.
While SRR1206-560YL is designed to be robust, it's not recommended for use in high-vibration or high-shock applications without proper testing and validation. Consult Bourns' application notes and perform reliability testing to ensure the component meets your specific requirements.

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