The recommended land pattern for the SRR1206-680YL is a rectangular pad with a size of 1.5 mm x 3.2 mm, with a non-solder mask defined (NSMD) pad shape.
During reflow soldering, the SRR1206-680YL should be placed on a flat, even surface to prevent warping or deformation. The recommended reflow profile is 260°C peak temperature, with a ramp-up rate of 3°C/s and a dwell time of 30-60 seconds.
The maximum operating temperature range for the SRR1206-680YL is -40°C to +125°C, with a derating of 1.5% per °C above 80°C.
Yes, the SRR1206-680YL is designed to withstand high-vibration environments, with a vibration rating of 10-2000 Hz, 10 G peak acceleration.
The SRR1206-680YL should be stored in a dry, cool place, away from direct sunlight and moisture. If the component is exposed to moisture, it should be baked at 125°C for 24 hours to remove any absorbed moisture.
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SRR1206-680YL Overview
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