SRR1208-470YL footprint, schematic symbol and 3D model by Bourns

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SRR1208-470YL Details

The recommended land pattern for the SRR1208-470YL can be found in the Bourns Application Note S-8151, which provides guidelines for PCB layout and land pattern design.
The SRR1208-470YL has a maximum operating temperature of 125°C. Ensure that the component is mounted on a PCB with a thermal relief pattern to dissipate heat effectively. Also, consider using a thermal interface material to improve heat transfer between the component and the PCB.
The recommended soldering profile for the SRR1208-470YL is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second. Refer to the Bourns Soldering Guidelines document for more information.
To ensure the reliability of the SRR1208-470YL in high-vibration applications, use a secure mounting method such as soldering or adhesive bonding. Also, consider using a potting compound to encapsulate the component and prevent mechanical stress.
The ESR of the SRR1208-470YL is not explicitly stated in the datasheet. However, according to Bourns' technical support, the typical ESR is around 0.5 ohms. For more accurate information, contact Bourns' technical support or refer to the component's spice model.

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