SRR7032-681M - Bourns

SRR7032-681M Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SRR7032-681M?
  The recommended PCB footprint for the SRR7032-681M is a rectangular pad with dimensions of 3.2mm x 1.6mm, with a 0.5mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
• How do I handle the SRR7032-681M during assembly to prevent damage?
  To prevent damage, handle the SRR7032-681M by the body only, avoiding touching the leads or the component's electrical contacts. Use anti-static wrist straps, mats, or other ESD protection devices to prevent electrostatic discharge damage.
• What is the maximum storage temperature for the SRR7032-681M?
  The maximum storage temperature for the SRR7032-681M is 40°C (104°F) for a maximum of 12 months. Storage above this temperature can affect the component's reliability and performance.
• Can I use the SRR7032-681M in a high-vibration environment?
  Yes, the SRR7032-681M is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent movement or detachment during operation.
• How do I solder the SRR7032-681M to the PCB?
  Use a soldering iron with a temperature of 250°C (482°F) to 270°C (518°F) and a solder with a melting point of 180°C (356°F) to 220°C (428°F). Apply a small amount of solder to the PCB pad and component lead, and use a gentle touch to avoid applying excessive force or heat.