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SRV05-4.TCT - SEMTECH

Description: Semtech SRV05-4.TCT, Uni-Directional TVS Diode Array, 300W, 6-Pin SOT-23

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PCB Footprints
SRV05-4.TCT - SEMTECH PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT-23 6L
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3D Models
SRV05-4.TCT - SEMTECH  - 3D model - SOT23 (6-Pin) - SOT-23 6L
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SRV05-4.TCT Details

  • Manufacturer Part Number:

    SRV05-4.TCT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE PACKAGE-6

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Semtech Corporation

  • YTEOL:

    6.28

  • Breakdown Voltage-Min:

    6 V

  • Clamping Voltage-Max:

    12.5 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SRV05-4.TCT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use 50-ohm impedance-controlled lines. Avoid vias and right-angle bends in the RF path.
  • Ensure good thermal conductivity by using a heat sink or a thermal pad on the package. Keep the device away from heat sources and ensure good airflow around the device. Monitor the junction temperature (TJ) and adjust the operating conditions accordingly.
  • The recommended input power level is between -20 dBm and +10 dBm. Exceeding the maximum input power can cause damage to the device. Use an attenuator or a limiter to regulate the input power.
  • Check the power supply voltage, input power level, and PCB layout. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Use a spectrum analyzer to check the input and output signals.
  • Yes, but impedance matching is required to ensure optimal performance. Use a matching network or a transformer to match the impedance of the system to the device's 50-ohm input/output impedance.

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SRV05-4.TCT Overview

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