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SS16FA - onsemi

Description: RoHS Compliant / Green Molding Compound; * See authorized use policy; Industrial Device Qualified per AEC-Q101 Standards; Low Power Loss, High Efficiency; High Surge Current Capability; UL Flammability 94V-0 Classification; Guard Ring for Overvoltage Protection; MSL 1 per J-STD-020

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Symbol
SS16FA - onsemi - PCB symbol
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PCB Footprints
SS16FA - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FA
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3D Models
SS16FA - onsemi - 3D model - Small Outline Diode Flat Lead - SOD-123FA
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SS16FA Details

  • Manufacturer Part Number:

    SS16FA

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Manufacturer Package Code:

    425AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.07

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    60 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    50 µA

  • Reverse Recovery Time-Max:

    0.0056 µs

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SS16FA Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Use a heat sink or thermal interface material to reduce thermal resistance. Also, consider derating the device's power handling at high temperatures.
  • A soldering profile with a peak temperature of 260°C and a dwell time of 10-30 seconds is recommended. The device should be soldered using a no-clean or water-soluble flux, and the PCB should be cleaned after soldering to prevent corrosion.
  • Handle the device by the body or pins, avoiding direct contact with the die. Use an ESD wrist strap or mat, and ensure that the workstation is ESD-protected. Store the device in an anti-static bag or container when not in use.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -40°C and 30°C, and the relative humidity should be below 60%.

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SS16FA Overview

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