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SS24T3G - onsemi

Description: Compact Package with J-Bend Leads Ideal for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Over-Voltage Protection; Low Forward Voltage Drop Mechanical Characteristics:; Case: Molded Epoxy; Epoxy Meets UL94, VO at 1/8''; Weight: 95 mg (approximately); Cathode Polarity Band; Lead and Mounting Surface Temperature for Soldering Purposes: 260?C Max. for 10 Seconds; Available in 12 mm Tape, 2500 Units per 13'' Reel, Add ''T3'' Suffix to Part Number; Finish: All External Surfaces Corro

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SS24T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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3D Models
SS24T3G - onsemi  - 3D model - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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SS24T3G Details

  • Manufacturer Part Number:

    SS24T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    75 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    400 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SS24T3G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are suggested. Refer to onsemi's application note AND8325/D for more details.
  • Ensure proper thermal management, follow the recommended PCB layout, and consider using a heat sink if necessary. Also, verify that the device is operated within the specified voltage and current ratings.
  • The SS24T3G has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and handling. For latch-up prevention, ensure that the device is operated within the specified voltage and current ratings, and avoid voltage spikes or transients.
  • Yes, the SS24T3G is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions, and consider additional testing and validation according to the specific industry standards (e.g., AEC-Q100).
  • Consult the onsemi troubleshooting guide AND8333/D, which provides a step-by-step approach to identifying and resolving common issues. Also, verify that the device is operated within the specified voltage and current ratings, and check for any signs of physical damage or contamination.

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SS24T3G Overview

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