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SS26B-HF - Comchip Technology

Description: Schottky Diodes & Rectifiers DIODE SCHOTTKY 2A 60V SMB

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PCB Footprints
SS26B-HF - Comchip Technology PCB footprint - Diodes Moulded - Diodes Moulded - SMB (DO-214AA)-AA
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3D Models
SS26B-HF - Comchip Technology  - 3D model - Diodes Moulded - SMB (DO-214AA)-AA
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SS26B-HF Details

  • Manufacturer Part Number:

    SS26B-HF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    6.22

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    500 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SS26B-HF Frequently Asked Questions (FAQs)

  • A good PCB layout for the SS26B-HF should ensure minimal inductance and resistance in the power lines, and keep the input and output capacitors close to the device. A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Additionally, the layout should minimize the loop area of the input and output lines to reduce EMI.
  • To ensure the SS26B-HF operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Keep the junction temperature below 150°C, input voltage within the recommended range (4.5V to 18V), and output current below the maximum rating (2A). Also, ensure proper thermal management and heat dissipation.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the input of the SS26B-HF. The capacitor should be placed as close as possible to the device's input pins to minimize inductance and ensure stable operation.
  • To troubleshoot issues with the SS26B-HF, start by checking the input voltage, output voltage, and output current. Verify that the device is operating within its recommended specifications. Check the PCB layout for any errors or omissions, and ensure proper thermal management. Use an oscilloscope to monitor the output voltage and current waveforms, and check for any signs of oscillation or instability.
  • Yes, the SS26B-HF is compatible with lead-free soldering processes. The device is RoHS compliant and can be soldered using lead-free solder alloys with a peak reflow temperature of 260°C.

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SS26B-HF Overview

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