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SS26FL - onsemi

Description: Ultra Thin Profile – Maximum Height of 1.08 mm; RoHS Compliant / Green Mold Compound; MSL level 1; UL Flammability 94V-0 Classification

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PCB Footprints
SS26FL - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD−123FL_1
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3D Models
SS26FL - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD−123FL_1
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SS26FL Details

  • Manufacturer Part Number:

    SS26FL

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Manufacturer Package Code:

    425AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.07

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    60 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    40 µA

  • Reverse Recovery Time-Max:

    0.0083 µs

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SS26FL Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, thermal vias can be used to further improve heat dissipation.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider using a heat sink or thermal interface material to reduce thermal resistance.
  • The maximum allowed voltage on the input pins is 30V, but it's recommended to keep it below 25V to ensure reliable operation and prevent damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines to protect the SS26FL from electrostatic discharge. Follow the recommended PCB layout and handling procedures to minimize ESD risks.
  • The recommended storage temperature range for the SS26FL is -40°C to 125°C. Storage outside this range may affect the device's reliability and performance.

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SS26FL Overview

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