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SS33 - Taiwan Semiconductor

Description: Schottky Diodes & Rectifiers 3A, 30V, Schottky Rectifier ● Low power loss, high efficiency ● Ideal for automated placement ● Guard ring for overvoltage protection ● High surge current capability ● Moisture sensitivity level: level 1, per J-STD-020 ● RoHS Compliant ● Halogen-free according to IEC 61249-2-21

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SS33 - Taiwan Semiconductor PCB footprint - Diodes Moulded - Diodes Moulded - SS33
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SS33 - Taiwan Semiconductor  - 3D model - Diodes Moulded - SS33
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SS33 Details

  • Manufacturer Part Number:

    SS33

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    6

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

SS33 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern around the pad are suggested. Additionally, a solid ground plane on the bottom layer can help reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines. Ensure proper heat sinking, and consider using a heat sink or thermal interface material to reduce junction temperature. Also, verify that the system design can handle the increased leakage current at high temperatures.
  • To prevent ESD damage, handle the devices with an anti-static wrist strap or mat, and ensure that the assembly process is ESD-controlled. Use a grounded soldering iron and avoid touching the pins or leads during assembly. Follow the recommended storage and shipping guidelines to prevent ESD damage during transportation.
  • Yes, the SS33 can be used in switching regulator applications. However, it's essential to ensure that the device is operated within the recommended switching frequency range and that the output voltage is properly filtered to prevent voltage spikes. Additionally, consider the device's power dissipation and thermal performance in the switching regulator design.
  • To accurately characterize the SS33, use the recommended test conditions outlined in the datasheet, including the specified voltage and current ranges, temperature, and load conditions. Ensure that the test setup is properly calibrated and that the device is operated within the recommended operating conditions.

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SS33 Overview

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Part Image SS33-E3/9AT Vishay Intertechnologies

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Part Image SS33HM6G Taiwan Semiconductor

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Part Image SS33M6G Taiwan Semiconductor

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Part Image SS33R6G Taiwan Semiconductor

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Part Image SS33 Micro Commercial Components

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For a full list of alternate parts for SS33, check out Findchips.com