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SSC53LHE3_A/H - Vishay

Description: Schottky Diodes & Rectifiers 5.0 Amp 30 Volt 175A IFSM @ 8.3ms

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PCB Footprints
SSC53LHE3_A/H - Vishay PCB footprint - Diodes Moulded - Diodes Moulded - SMC (DO-214AB)
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3D Models
SSC53LHE3_A/H - Vishay  - 3D model - Diodes Moulded - SMC (DO-214AB)
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SSC53LHE3_A/H Details

  • Manufacturer Part Number:

    SSC53LHE3_A/H

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SMC, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.12

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.45 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    175 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    700 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SSC53LHE3_A/H Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a large copper area for the thermal pad, with multiple vias to the bottom layer to dissipate heat efficiently. Additionally, keeping the component away from other heat sources and using a thermal interface material can help.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a hot air gun to solder the component. Avoid overheating or applying excessive force, which can damage the component.
  • The maximum allowed voltage derating for the SSC53LHE3_A/H is typically 80% of the maximum rated voltage. However, it's recommended to consult with the manufacturer or a qualified engineer to determine the appropriate derating factor based on the specific application and environmental conditions.
  • The SSC53LHE3_A/H is designed for low-frequency applications. While it may be possible to use it in a high-frequency application, the component's performance and reliability may be compromised. It's recommended to consult with the manufacturer or a qualified engineer to determine the suitability of the component for high-frequency applications.
  • The SSC53LHE3_A/H is a moisture-sensitive device. To handle it safely, store the component in a dry, nitrogen-filled package or a moisture barrier bag. Avoid exposing the component to humid environments, and follow the manufacturer's recommended baking and handling procedures to prevent moisture-related damage.

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SSC53LHE3_A/H Overview

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Part Image SSC53L-E3/9AT Vishay Intertechnologies

Rectifier Diode, Schottky, 1 Phase, 1 Element, 5A, 30V V(RRM), Silicon, DO-214AB

Part Image SSC53L-E3/9AT Vishay Semiconductors

DIODE 5 A, 30 V, SILICON, RECTIFIER DIODE, DO-214AB, ROHS COMPLIANT, PLASTIC, SMC, 2 PIN, Rectifier Diode