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SSM2142SZ-REEL - Analog Devices

Description: SP Amp Line Driver Amp Single ±18V 16-Pin SOIC W T/R

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SSM2142SZ-REEL - Analog Devices - PCB symbol
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PCB Footprints
SSM2142SZ-REEL - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RW-16 (SOIC)
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SSM2142SZ-REEL - Analog Devices - 3D model - Small Outline Packages - RW-16 (SOIC)
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SSM2142SZ-REEL Details

  • Manufacturer Part Number:

    SSM2142SZ-REEL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOL-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    RW-16

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Nom (Vsup):

    -18 V

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max (Isup):

    7 mA

  • Supply Voltage-Nom (Vsup):

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

SSM2142SZ-REEL Frequently Asked Questions (FAQs)

  • A good PCB layout for the SSM2142SZ-REEL involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing the device close to the power supply decoupling capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, decouple the power supply lines with 10uF and 100nF capacitors.
  • The maximum power dissipation of the SSM2142SZ-REEL is 1.4W. However, this can be affected by the ambient temperature, PCB layout, and thermal management. It's essential to ensure good thermal management to prevent overheating.
  • The SSM2142SZ-REEL is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to ensure good thermal management and consider derating the device's power dissipation at high temperatures.
  • To troubleshoot issues with the SSM2142SZ-REEL, start by checking the power supply voltage, input and output signals, and PCB layout. Use an oscilloscope to check for oscillations, noise, or distortion. Also, ensure that the device is properly decoupled and that the input and output capacitors are of high quality.

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SSM2142SZ-REEL Overview

Use the download button to access the SSM2142SZ-REEL schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SSM21, or try a keyword search, such as Other Analog ICs

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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